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| There are two types about HHL package of high-power semiconductor laser power output one is window output, the other is fiber output. Fiber output is divided into the diameter of 100um fiber, 0.22NA and the diameter of 200um fiber, 0.11NA. Products applied to laser pump sources, medical, printing, heating, materials processing, marking, such as the need for high-brightness and long-life applications. |
| Features |  |
Applications | |
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| Specifications (25¡æ) |
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| Specifications (25¡æ) | Symbol | Unit | Output Power | |||
| Optical Specification | Output Power | P | W | 2 | 3 | 4 |
| Center Wavelength | ¦Ëc | nm | 808 | |||
| Wavelength Tolerance | - | nm | ¡À3,¡À5 | |||
| Spectral Width | nm | <3 | ||||
| Wavelength Temperature Coefficient | - | nm/¡æ | 0.3 | |||
| Electrical Specification | Operating Current | Iop | A | 2 | 3 | 4.3 |
| Threshold Current | Ith | A | 0.5 | 0.7 | 0.7 | |
| Operating Voltage | Vop | V | 1.8 | 1.9 | 2.0 | |
| Slop Efficiency | ¦ÇD | W/A | 0.8~1.0 | |||
| TEC Specification | Max. Current | It | A | 3.9 | ||
| Max. Voltage | Vt | V | 8.6 | |||
| Thermistor Specification | Thermistor | Rt | (K ¦¸)/¦Â(25¡æ) | 10¡À5% | ||
| Other Specification | Operating Temperature | Top | ¡æ | 10~30 | ||
| Storage Temperature | Tst | ¡æ | -20~80 | |||
| Expected Lifetime | MTTF | > 10000 | ||||
| Lead Soldering Temperature | Tis | 260(10sec) | ||||
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| Package Dimensions | |
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Pin Function£º 1 TEC(-) 2 - 3 case 4 LD(+) 5 Thermistor 6 Thermistor 7 LD(-) 8 PD (P) 9 PD (N) 10 TEC(+) |
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| Notes |
| 1. Avoid eye and skin laser irradiation when lasers are working. 2. Anti-static measures must be taken when transportation, storage and using. Transportation and storage process must be connected between pin short route protection. 3. Using of constant current power supply and working hours to avoid surge. 4. The laser should be rated current, rated power use. 5. Lasers work require to ensure good heat dissipation. 6. Working temperature 10 ¡æ ~ 30 ¡æ. 7. Storage temperature -20 ¡æ ~ +80 ¡æ. |